Conductive film removal agent and conductive film removal method
US8617418B2 · kind B2 · utility
2Cited by
0References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2010 |
| Grant date | Dec 31, 2013 |
| Priority date | — |
| Expiry date | Jun 2, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed is an agent for removing a conductive film, which contains: an acid having a boiling point of 80° C. or higher, a base having a boiling point of 80° C. or higher, or a compound which generates an acid or a base by external energy in combination with a solvent, a resin, and a leveling agent. Also disclosed is a method for removing a conducting film, which uses the agent for removing a conductive film. The agent for removing a conductive film and the method for removing a conductive film are capable of in-place uniformity removing a desired portion of a conductive film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.