Multilayer films for reclosable packaging
US8617677B2 · kind B2 · utility
15Cited by
12References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2012 |
| Grant date | Dec 31, 2013 |
| Priority date | — |
| Expiry date | Jul 20, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/60
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Disclosed is a multilayer structure that comprises a heat sealable layer comprising amorphous polyethylene terephthalate with a melting point greater than 200° C., a pressure sensitive adhesive and at least one tie layer encapsulating the pressure sensitive adhesive. The structure can be coextruded without degrading the pressure sensitive adhesive. Also disclosed is a reclosable package comprising the structure and methods to make such structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.