Functionalized metal nanoparticle, buffer layer including the same and electronic device including the buffer layer
US8617709B2 · kind B2 · utility
1Cited by
5References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 4, 2008 |
| Grant date | Dec 31, 2013 |
| Priority date | — |
| Expiry date | Aug 21, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2991
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
Disclosed herein is a functionalized metal nanoparticle, a buffer layer including the functionalized metal nanoparticle, and an electronic device including the buffer layer. The buffer layer including the functionalized metal nanoparticle according to example embodiments may improve the injection of electrons or holes and the charge mobility between layers in the electronic device, may form ohmic contacts, and may improve the selectivity between electrodes and the buffer layer at the time of forming the buffer layer on the electrodes, thereby improving the efficiency of the electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.