Bonding layer on fluoropolymers
US8617713B2 · kind B2 · utility
0Cited by
4References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 17, 2008 |
| Grant date | Dec 31, 2013 |
| Priority date | — |
| Expiry date | Feb 4, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/3154
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The invention relates to a device comprising a layer made from a fluoropolymer, of which at least part of the surface is covered with a composition comprising a polymer having at least one fluorinated function and at least one acid or base function and forming a bonding layer on said fluoropolymer, said bonding layer being fully or partly covered by another layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.