Lifting-off method and method for manufacturing TFT array substrate

US8618001B2 · kind B2 · utility

Assignees

• BOE Technology Group Co., Ltd. · CN
• BEIJING BOE DISPLAY TECHNOLOGY CO., LTD. · CN

Inventors

• Yongzhi Song · Beijing, CN
• Zhaohui Hao · Beijing, CN
• Xu Wang · Jinan, CN
• Huiyue LUO · Beijing, CN
• Guojing Ma · Beijing, CN

Key dates

• Filing date: Nov 29, 2011
• Grant date: Dec 31, 2013
• Expiry date: Jan 11, 2032

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T156/1111

Abstract

A lifting-off method and a manufacturing method for a thin film transistor (TFT) array substrate using the same are provided. A lifting-off method comprises forming a cavitation jet flow by using a lifting-off solution, and impacting a to-be-lifted-off surface of a substrate by means of the cavitation jet flow to remove a photoresist and a film deposited on the photoresist over the to-be-lifted-off surface. The disclosure may be applied to manufacturing processes for semiconductor devices or TFT array substrate.