Polyamide resin composition and molded product using the same
US8618209B2 · kind B2 · utility
7Cited by
2References
8Claims
0Family size
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Key dates
| Filing date | Dec 20, 2011 |
| Grant date | Dec 31, 2013 |
| Priority date | — |
| Expiry date | Dec 20, 2031 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L77/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed are a polyamide resin composition that includes (A) a crystalline polyamide mixed resin including an aliphatic group and at least two different crystalline polyamide resins, (B) a non-crystalline polyamide resin including an aromatic group, and (C) a glass fiber, and a molded product manufacture using the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.