Semiconductor packages
US8618540B2 · kind B2 · utility
1Cited by
7References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 31, 2011 |
| Grant date | Dec 31, 2013 |
| Priority date | — |
| Expiry date | Nov 14, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided are a semiconductor package, a semiconductor memory module including the semiconductor package, and a system including the semiconductor memory module. The semiconductor package may include a plurality of main terminals arranged on a surface of the semiconductor package with constant intervals, and the plurality of main terminals may include terminals of a first set including a plurality of input/output terminals to which test signals may be input, and terminals of a second set including a plurality of input/output terminals to/from which signals other than the test signals may be input/output.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.