Method for manufacturing light-emitting device and film formation substrate
US8618568B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 8, 2010 |
| Grant date | Dec 31, 2013 |
| Priority date | — |
| Expiry date | Apr 18, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/40
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
In a method for manufacturing a light-emitting device according to an embodiment of the present invention, one surface of a first substrate including a reflective layer including an opening, a light absorption layer formed over the reflective layer to cover the opening in the reflective layer, a protective layer formed over the light absorption layer and including a groove at a position overlapped with the opening in the reflective layer, and a material layer formed over the protective layer and a deposition surface of a second substrate are disposed to face each other and light irradiation is performed from the other surface side of the first substrate, so that an EL layer is formed in a region on the deposition surface of the second substrate, which is overlapped with the opening in the reflective layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.