Method of manufacturing the piezoelectric device and the same
US8618721B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 12, 2011 |
| Grant date | Dec 31, 2013 |
| Priority date | — |
| Expiry date | Nov 22, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
To provide a piezoelectric device prevented from overflowing of sealing materials. The piezoelectric device (100) stores a piezoelectric vibrating piece (30) having a pair of excitation electrodes. The piezoelectric device comprises: a package lid (10), including a first bonding surface (M1) formed in periphery of the package lid in a circumferential pattern and a lid recess (10); a package base (30), including a second bonding surface (M2), a base recess surrounded by a second bonding surface that is higher than the second bonding surface, and a pair of seats that is protruding from the base recess, situated for mounting the piezoelectric piece; a piezoelectric piece mounted onto the pair of seats; and a non electric conductive sealing material (48) disposed peripherally in relative to the first bonding surface and the second bonding surface in a circumferential pattern, thus the adhesive bonding the first bonding surface and the second bonding surface. Furthermore, height of the second bonding surface and the pair of seats are same height.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.