Thermal management for data modules
US8620235B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 21, 2009 |
| Grant date | Dec 31, 2013 |
| Priority date | — |
| Expiry date | Oct 28, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D30/70
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
A data module operable in a wireless communication system is provided. The data module comprises a plurality of circuit components, one or more temperature sensors, and a thermal management unit. The temperature sensors are configured to determine the temperature of a corresponding circuit component. The thermal management unit is configured to determine one or more thermal characteristics of the data module based on the temperature determinations, and to generate one or more power control point signals indicating whether to adjust corresponding operating characteristics of a target component based on the determined thermal characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.