Method of making an electrical circuit structure
US8621750B2 · kind B2 · utility
1Cited by
7References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 23, 2009 |
| Grant date | Jan 7, 2014 |
| Priority date | — |
| Expiry date | Nov 7, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1052
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electrical interconnect has an adhesive layer in which is formed an array of apertures, the apertures being of non-circular shape. An electrical circuit apparatus has a first circuit having at least one electrical contact, a second circuit having at least one electrical contact aligned to the electrical contact of the first circuit, and a standoff structure between the first and second circuits having at least one aperture aligned to one electrical contact of the first and second circuits, the aperture being of a non-circular shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.