Method for making patterned conductive element
US8623224B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 29, 2011 |
| Grant date | Jan 7, 2014 |
| Priority date | — |
| Expiry date | Mar 16, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K30/821
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure relates to a method for making pattern conductive element. The method includes steps. A substrate having a surface is provide. An adhesive layer is formed on the surface of the substrate. Part of the adhesive layer is solidified to form a solidified adhesive layer and a non-solidified adhesive layer. A carbon nanotube layer is applied on the adhesive layer. The non-solidified adhesive layer is solidified so that the carbon nanotube layer on the non-solidified adhesive layer forms a fixed carbon nanotube layer and the carbon nanotube layer on the solidified adhesive layer forms a non-fixed carbon nanotube layer. The non-fixed carbon nanotube layer is removed and the fixed carbon nanotube layer is remained to form a pattern carbon nanotube layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.