Patent · US Active

Method for producing a flexible circuit configuration

US8623450B2 · kind B2 · utility

0Cited by

2References

29Claims

0Family size

Assignee

Cicor Management AG · CH

Inventors

Ernst Feurer · Blaustein, DE
Bruno Holl · Ulm, DE
Alexander Kaiser · Neutraubling, DE
Karin Ruess · Stuttgart, DE

Key dates

Filing date	Oct 1, 2010
Grant date	Jan 7, 2014
Priority date	—
Expiry date	Dec 12, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1536
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

For a method for producing a flexible circuit configuration in the form of a layer sequence of at least one insulating layer and at least one conductive layer, typically multiple insulating layers (N1, N2, N3, NF) and multiple structured conductive layers (L1, L2), the layer sequence for the flexible circuit configuration is deposited on a rigid substrate so that the adhesion of the layer sequence with respect to the substrate is less in an inner area, in which at least one, preferably multiple flexible circuit configurations are created, than in an edge area (RB) which surrounds the inner area (ZB). An intermediate layer can advantageously be deposited for this purpose in the edge area, which causes a stronger adhesion of the layer sequence over the edge area than the inner area, which is not provided with an intermediate layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.