Method for manufacturing LED
US8623678B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 7, 2012 |
| Grant date | Jan 7, 2014 |
| Priority date | — |
| Expiry date | Aug 18, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0362
Abstract
A method for manufacturing an LED is disclosed. Firstly, a base with two leads is provided. The base has a cavity defined in a top face thereof and two holes defined in two lateral faces thereof. The two holes communicate the cavity with an outside environment. A chip is fixed in the cavity and electrically connected to the two leads. A cover is placed on the top face of the base to cover the cavity. An encapsulation liquid is filled into the cavity through one hole until the encapsulation liquid joins a bottom face of the cover. Finally, the encapsulation liquid is cured to form an encapsulant. A top face of the cover functions as a light emergent face of the LED.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.