Patent · US Active

Inter-chip communication

US8623700B1 · kind B1 · utility

13Cited by

106References

19Claims

0Family size

Assignee

University of Notre Dame du Lac · US

Inventors

Gary H. Bernstein · Granger, US
Patrick Fay · Granger, US
Wolfgang Porod · Granger, US
Qing Liu · Beijing, CN

Key dates

Filing date	Nov 15, 2006
Grant date	Jan 7, 2014
Priority date	—
Expiry date	Sep 5, 2028

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY02P70/50
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

The present invention provides a quilt packaging system for microchip, a method for making such a quilt packaging system, microchips that may be used in a such a quilt packaging system, and methods for making such microchips.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.