Epoxy resin composition, curing agent, and curing accelerator
US8623942B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2010 |
| Grant date | Jan 7, 2014 |
| Priority date | — |
| Expiry date | Jun 4, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L63/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides a liquid curable epoxy resin composition that has excellent storage stability and curing properties and provides a cured product having excellent properties, particularly, excellent organic solvent resistance. For that purpose, a clathrate containing a carboxylic acid compound and at least one selected from the group consisting of an imidazole compound represented by formula (I), wherein R1 to R4 each represent a hydrogen atom or the like, and 1,8-diazabicyclo[5.4.0]undecene-7 (DBU) is mixed in an epoxy resin. The liquid curable epoxy resin composition uses a liquid epoxy resin or an organic solvent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.