Method of attaching a high power surface mount transistor to a printed circuit board
US8624129B2 · kind B2 · utility
1Cited by
9References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 12, 2006 |
| Grant date | Jan 7, 2014 |
| Priority date | — |
| Expiry date | Jun 15, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10174
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A power device that includes a printed circuit board having one or more dielectric and copper layers between a top and a bottom metal layer. The power device includes an area extending through all metal and dielectric layers of the printed circuit board except the bottom metal layer. A semiconductor device is positioned within the area and mounted to the bottom metal layer of the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.