Inducement of strain in a semiconductor layer
US8624319B2 · kind B2 · utility
0Cited by
3References
20Claims
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Key dates
| Filing date | Jan 25, 2011 |
| Grant date | Jan 7, 2014 |
| Priority date | — |
| Expiry date | Jan 25, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/822
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Strain is induced in a semiconductor layer. Embodiments include inducing strain by, for example, creation of free surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.