Epoxy resin composition for optical semiconductor device, lead frame for optical semiconductor device and substrate for optical semiconductor device obtained using the same, and optical semiconductor device
US8624343B2 · kind B2 · utility
3Cited by
2References
16Claims
0Family size
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Key dates
| Filing date | Aug 2, 2012 |
| Grant date | Jan 7, 2014 |
| Priority date | — |
| Expiry date | Aug 2, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8506
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to an epoxy resin composition for an optical semiconductor device, including the following ingredients (A) to (E): (A) an epoxy resin; (B) a curing agent; (C) a white pigment; (D) an inorganic filler; and (E) a silane coupling agent, in which a total content of the ingredient (C) and the ingredient (D) is from 69 to 94% by weight of the whole of the epoxy resin composition, and the ingredient (E) is contained in an amount satisfying the specific conditions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.