Micromachined ultrasonic transducer with air-backed cavity and electrical connection
US8624469B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2011 |
| Grant date | Jan 7, 2014 |
| Priority date | — |
| Expiry date | Apr 22, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/42
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A method and associated apparatus directed to a piezoelectric micromachined ultrasonic transducer (pMUT) defining an air-backed cavity are provided. A first via defined by a device substrate and associated dielectric layer, and extending to the first electrode, is substantially filled with a first conductive material. A support member engaged with the device substrate defines a second via extending to the first conductive material. The second via has a second conductive material disposed thereon, forms an electrically-conductive engagement with the first conductive material, and extends outwardly of the second via to be accessible externally to the support member. A connective element extends through a third via defined by a connection support substrate and is in electrically-conductive engagement with the second conductive material, wherein one of the connective element and connection support substrate is bonded to one of the support member and second conductive material by a bonding material engaged therebetween.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.