Piezoelectric devices including electrode-less vibrating portions
US8624470B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 21, 2011 |
| Grant date | Jan 7, 2014 |
| Priority date | — |
| Expiry date | Feb 16, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H9/19
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
An exemplary piezoelectric device has a piezoelectric vibrating board including a portion that exhibits thickness-shear vibration, and a frame portion extending around and supporting the vibrating portion. A first cover board, bonded to the first main surface of the frame portion, has a first excitation electrode. A second cover board, bonded to the second main surface of the frame portion, has a second excitation electrode. Thus, the vibrating portion is sealed in a package formed by the frame portion and cover boards. A first convexity, defined either on the bonded main surface of the first cover board or on the first main surface of the frame portion, surrounds the excitation electrode and establishes a predetermined gap between the vibrating portion and excitation electrode. The first cover board and frame portion are bonded by adhesive applied, adjacent the first convexity but not on the first convexity, continuously around the vibrating portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.