Cooling memory modules using cold plate blades coupled to the memory modules via clips
US8625280B2 · kind B2 · utility
3Cited by
7References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2009 |
| Grant date | Jan 7, 2014 |
| Priority date | — |
| Expiry date | Aug 22, 2030 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/20
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A cold plate has blades arranged to be interleaved with memory modules, with clips coupling blades to memory modules. A liquid cooling loop is thermally coupled to the blades of the cold plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.