Tiling allocations for wireless communication
US8625498B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 22, 2007 |
| Grant date | Jan 7, 2014 |
| Priority date | — |
| Expiry date | Dec 31, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04W72/1263
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
Allocations for access in a wireless system may be tiled onto a subframe having a first dimension and a second dimension. In an exemplary embodiment, allocations are distributed along the first dimension while the second dimension is locked, and the allocations are distributed along the second dimension while the first dimension is locked. In another exemplary embodiment, allocations are striped by extending a length of a first allocation along the first dimension and by expanding a breadth of the first allocation along the second dimension responsive to a size of the first allocation and by extending a length of a second allocation along the second dimension and expanding a breadth of the second allocation along the first dimension responsive to a size of the second allocation. In yet another exemplary embodiment, multiple allocations are placed proximately to an allocation placement target and allocation-free areas are produced on a subframe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.