T1 lead-board for a shipping platform

US8627773B2 · kind B2 · utility

Assignee

• CHEP Technology Pty Limited · AU

Inventors

• John Thomas Storteboom · Roswell, US
• Oivind Brockmeier · Somerville, US
• Brandon Michael D'Emidio · Orlando, US
• Timothy R. Proulx · Nashua, US
• Gregory S. Burkett · Cambridge, US
• Jeffrey Ryan Chapin · Cambridge, US
• Kenneth Brandt · Bedugul, ID

Key dates

• Filing date: Dec 15, 2012
• Grant date: Jan 14, 2014
• Expiry date: Dec 15, 2032

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49947
• WIPO field: Handling
• WIPO sector: Mechanical engineering

Abstract

A system may include a bottom deck to a shipping platform, and a block joined to the bottom deck. The system may also include a top deck joined to the block. The system may further include a T1 lead-board structurally different from the top deck fastened to an edge of the top deck.