Patent · US Active

Apparatus for guiding and aligning semiconductor chip package

US8628069B2 · kind B2 · utility

2Cited by
3References
15Claims
0Family size

Assignee

Inventor

Key dates

Filing dateMar 18, 2010
Grant dateJan 14, 2014
Priority date—
Expiry dateNov 14, 2032

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01R31/2893
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

Provided is an apparatus for guiding and aligning a semiconductor chip package. The apparatus may include an insert, a plate above the insert, and an adapter. The insert may be configured to house various sizes of semiconductor chip packages. The plate may be configured to move vertically with respect to the insert. The adapter may be coupled to the plate and may be configured to guide at least one semiconductor chip package into the insert and to perform alignment of the at least one semiconductor chip package. In accordance with example embodiments, the at least one semiconductor chip package may have a size corresponding to at least one of the various sizes.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.