Method for measuring contacting thermal resistance of one-dimensional structures
US8628237B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Jan 24, 2013 |
| Grant date | Jan 14, 2014 |
| Priority date | — |
| Expiry date | Jan 24, 2033 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N25/18
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for measuring a contacting thermal resistance of one-dimensional structures is provided. A first one-dimensional structure and A second one-dimensional structure are crossed and in contact with each other to form a suspended junction. A point P of the first one-dimensional structure is heated until the first one-dimensional structure and the second one-dimensional structure reach a thermal equilibrium. A point A and a point B are selected on the first one-dimensional structure and a point C and a point D are selected on the second one-dimensional structure, wherein the point B, the point A, the suspended junction, the point C and the point D are arranged equidistantly with a distance Δx. A temperature difference ΔTj is calculated by the formula ΔTj=ΔTAC−ΔTBA−ΔTCD. The heat flux Qj is calculated by the formula Qj=2kΔTCD/Δx. The contacting thermal resistance Rj is calculated by the formula Rj=ΔTj/Qj.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.