Vapor deposition device and vapor deposition method
US8628620B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2011 |
| Grant date | Jan 14, 2014 |
| Priority date | — |
| Expiry date | Dec 28, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A vapor deposition device (50) includes a mask (60) having periodic patterns, and only a region of the mask (60) where a one-period pattern is formed is exposed. A length of the mask base material along a direction perpendicular to a long-side direction of the mask base material is shorter than a length of a film formation substrate (200) along a direction of scanning of the film formation substrate (200). The mask (60) is provided so that the long-side direction of the mask base material is perpendicular to the direction of scanning and that the exposed region is allowed to move in a direction perpendicular to the direction of scanning by rotation of a wind-off roll (91) and a wind-up roll (92).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.