System and method for providing the capability of peeling thin polymer films from a substrate
US8628714B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | Sep 28, 2007 |
| Grant date | Jan 14, 2014 |
| Priority date | — |
| Expiry date | Mar 21, 2029 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2038/0076
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A system and method for providing the capability of peeling thin polymer films from a substrate is provided. Generally, the method contains the steps of: providing a substrate having a top surface and a bottom surface; placing a peel initiator on the top surface; applying a polymer on the top surface of the substrate and a top surface of the peel initiator; curing the polymer, resulting in a thin-polymer film; and peeling the peel initiator from the substrate, thereby removing the thin-polymer film from the top surface of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.