Manufacturing of electronic components
US8629015B2 · kind B2 · utility
0Cited by
2References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 3, 2009 |
| Grant date | Jan 14, 2014 |
| Priority date | — |
| Expiry date | Aug 11, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/821
Abstract
According to an aspect of the invention, a method is provided for manufacturing electronic components. A conducting element comprising a first portion, a second portion and a third portion between the first portion and the second portion is provided. Thermally responsive dielectric material is added at least onto the third portion of the conducting element. Electric current is supplied between the first portion and the second portion of the conducting element causing ohmic heating to affix dielectric material located on the third portion to the third portion. Non-thermally-affixed dielectric material is removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.