Circuit board structure comprising an electrical component and a method for manufacturing a circuit board structure comprising an electrical component

US8631566B2 · kind B2 · utility

Assignee

• Imbera Electronics Oy · FI

Inventors

• Petteri Palm · Regensburg, DE
• Tuomas Waris · Helsinki, FI

Key dates

• Filing date: Aug 24, 2009
• Grant date: Jan 21, 2014
• Expiry date: Aug 25, 2031

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49146
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method for manufacturing a circuit board structure comprising at least one electrical component. The method comprises the steps of fabricating a conductive pattern on the surface of an essentially plane-like layer on the back side of the plane-like layer, and forming an electrical contact between the at least one electrical component and the conductive pattern. The method further comprises the steps of attaching the at least one electrical component to the back side of the plane-like layer after the fabrication of the conductive pattern, molding encapsulation material on the back side of the plane-like layer so that the encapsulation material at least partly encloses the at least one electrical component attached to the back side of the plane-like layer, and forming holes through the conductive pattern at positions where terminals of the at least one electrical component is attached to the back side of the plane-like layer and become positioned when the at least one electrical component is attached to the circuit board structure.