LED module and method of bonding thereof
US8632221B2 · kind B2 · utility
3Cited by
3References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 1, 2011 |
| Grant date | Jan 21, 2014 |
| Priority date | — |
| Expiry date | Jul 25, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0285
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present disclosure provides a method including providing a light-emitting diode (LED) device (e.g., a LED element and PCB) and a heat sink. The LED device is bonded to the heat sink by applying an ultrasonic energy. In an embodiment, the bonding may form a bond comprising copper and aluminum. The PCB may be a metal core PCB (MC-PCB).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.