Controlled flow of a thin liquid film by electrowetting
US8632670B2 · kind B2 · utility
28Cited by
4References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 13, 2011 |
| Grant date | Jan 21, 2014 |
| Priority date | — |
| Expiry date | Nov 12, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB01D57/02
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Apparatus and methods for controllably wetting a microstructured surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.