Mold structures, and method of transfer of fine structures
US8632714B2 · kind B2 · utility
2Cited by
16References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2012 |
| Grant date | Jan 21, 2014 |
| Priority date | — |
| Expiry date | Jun 19, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C1/0046
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A mold and a pattern transfer method using the same for a nanoprinting technology. The mold can be released from a substrate accurately and easily. The mold, which is used for forming a fine pattern on a substrate using a press machine, comprises a release mechanism.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.