Method for manufacturing a sensor chip
US8633047B2 · kind B2 · utility
3Cited by
29References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2012 |
| Grant date | Jan 21, 2014 |
| Priority date | — |
| Expiry date | Aug 29, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present sensor chip comprises a substrate. A plurality of electrode elements is arranged at a first level on the substrate with at least one gap between neighbouring electrode elements. A metal structure is arranged at a second level on the substrate, wherein the second level is different from the first level. The metal structure at least extends over an area of the second level that is defined by a projection of the at least one gap towards the second level.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.