Laser machining systems and methods with debris extraction
US8633420B2 · kind B2 · utility
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19References
16Claims
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Assignee
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Key dates
| Filing date | Oct 9, 2009 |
| Grant date | Jan 21, 2014 |
| Priority date | — |
| Expiry date | Jul 6, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/36
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Laser machining systems and methods may include debris removal systems to remove debris generated by the machining process and/or outgassing or filtration systems to remove harmful gases and filter and recycle air within the system. The laser machining systems and methods may be used to scribe one or more lines in large flat workpieces such as solar panels. In particular, laser machining systems and methods may be used to scribe lines in thin film photovoltaic (PV) solar panels with accuracy, high speed and reduced cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.