Organic electronic packages having hermetically sealed edges and methods of manufacturing such packages

US8633574B2 · kind B2 · utility

Assignee

• General Electric Company · US

Inventors

• Marc Schaepkens · Ballston Lake, US
• Anil Raj Duggal · Niskayuna, US
• Christian Maria Anton Heller · Albany, US

Key dates

• Filing date: Mar 13, 2013
• Grant date: Jan 21, 2014
• Expiry date: Mar 13, 2033

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31504

Abstract

Organic electronic packages having sealed edges. More specifically, packages having organic electronic devices are provided. A number of sealing mechanisms are provided to hermetically seal the edges of the package to completely protect the organic electronic device from external elements. A sealant may be implemented to completely surround the organic electronic device. Alternatively, edge wraps may be provided to completely surround the organic electronic device.