Device comprising an encapsulation unit
US8633585B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2009 |
| Grant date | Jan 21, 2014 |
| Priority date | — |
| Expiry date | Aug 7, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A device in accordance with one embodiment comprises component (1) and an encapsulation arrangement (2) for the encapsulation of the component (1) with respect to moisture and/or oxygen, wherein the encapsulation arrangement (2) has a first layer (21) and thereabove a second layer (22) on at least one surface (19) of the component (1), the first layer (21) and the second layer (22) each comprise an inorganic material, and the second layer (22) is arranged directly on the first layer (21).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.