LED package, LED package module having the same and manufacturing method thereof, and head lamp module having the same and control method thereof
US8633643B2 · kind B2 · utility
6Cited by
10References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2010 |
| Grant date | Jan 21, 2014 |
| Priority date | — |
| Expiry date | Nov 25, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10969
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Disclosed are an LED package, an LED package module having the same and a manufacturing method thereof, and a head lamp module having the same and a control method thereof. The light emitting diode package includes: a package substrate; a light emitting diode chip mounted on one surface of the package substrate; an electrode pad formed on the other surface of the package substrate and electrically connected to the light emitting diode chip; and a heat radiation pad formed on the other surface of the package substrate and electrically insulated from the electrode pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.