Reduced footprint substrate interleaver for food preparation line
US8635837B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 5, 2009 |
| Grant date | Jan 28, 2014 |
| Priority date | — |
| Expiry date | Jul 27, 2030 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA22C17/0033
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A food processing system having a slicer/former for food preparations having a feed conveyor, a stacker for stacking food preparations, and n interleaver for inserting a substrate under a food preparation from the food slicer/former as it transitions to the stacker. The interleaver is arranged such that a portion of the interleaver is located beneath the feed conveyor of the slicer/former. The interleaver includes an interleaver conveyor which extends from the feed conveyor to the stacker in-feed conveyor, and an overall length of the interleaver conveyor is less than a length of the interleaver in order to provide a reduced footprint interleaver for new and retro-fit applications having a limited length for the food processing system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.