Phenoxyphenyl polysiloxane composition and method for making and using same
US8637627B2 · kind B2 · utility
1Cited by
1References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2008 |
| Grant date | Jan 28, 2014 |
| Priority date | — |
| Expiry date | Feb 19, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable phenoxyphenyl polysiloxane composition is disclosed. A cured phenoxyphenyl polysiloxane composition is further disclosed, along with a method of making that cured phenoxyphenyl polysiloxane composition from the curable phenoxyphenyl silicon composition. An encapsulated semiconductor device, and a method of making that encapsulated semiconductor device by coating a semiconductor element of a semiconductor device with cured phenoxyphenyl polysiloxane are further disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.