Camera module and manufacturing method thereof
US8637949B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Nov 10, 2009 |
| Grant date | Jan 28, 2014 |
| Priority date | — |
| Expiry date | Nov 28, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/00014
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method includes forming a wafer assembly of a semiconductor wafer and a light transmissible optical wafer which are fixed to each other, cutting the wafer assembly at a spacer unit to individually divide the wafer assembly into a plurality of camera modules each comprising a sensor chip and a lens chip bonded to each other by a spacer, forming a light shieldable mask film to determine a lens aperture of each of plural lens units on the light transmissible optical wafer; forming a groove in the light transmissible optical wafer that reaches the spacer unit and filling the groove with a light shieldable resin to form a light shieldable resin layer; and cutting the light shieldable resin layer at a width less than the groove to individually divide the camera modules in each of which the light shieldable resin layer is provided at a side of the lens chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.