Micromechanical method and corresponding assembly for bonding semiconductor substrates and correspondingly bonded semiconductor chip
US8638000B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2010 |
| Grant date | Jan 28, 2014 |
| Priority date | — |
| Expiry date | Sep 23, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A micromechanical assembly for bonding semiconductor substrates includes a semiconductor substrate having a chip pattern having a plurality of semiconductor chips, each having a functional region and an edge region surrounding the functional region. There is a bonding frame made of a bonding alloy made from at least two alloy components in the edge region, spaced apart from the functional region. Within the part of the edge region surrounding the bonding frame between the bonding frame and the functional region, there is at least one stop frame made of at least one of the alloy components, which is configured such that when a melt of the bond alloy contacts the stop frame during bonding, the bonding alloy solidifies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.