Adhesive sheet for producing semiconductor device
US8638001B2 · kind B2 · utility
10Cited by
0References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 16, 2012 |
| Grant date | Jan 28, 2014 |
| Priority date | — |
| Expiry date | May 16, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An object of the present invention is to provide an adhesive sheet that can capture cations mixed in from outside during various processes of manufacturing a semiconductor device to prevent deterioration in electrical characteristics of a semiconductor device to be manufactured and to improve product reliability. It is an adhesive sheet for producing a semiconductor device, in which when 2.5 g of the adhesive sheet is soaked in 50 ml of an aqueous solution containing 10 ppm of copper ions, and the solution is left at 120° C. for 20 hours, the concentration of copper ions in the aqueous solution is 0 to 9.9 ppm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.