Vertical mount transient voltage suppressor array

US8638535B2 · kind B2 · utility

Assignee

• Hamilton Sundstrand Corporation (HSC) · US

Inventors

• Kevin P. Roy · West Springfield, US
• Richard A. Poisson · Avon, US
• Jay W. Kokas · Town of East Granby, US
• Edward John Marotta · Longmeadow, US
• Robert C. Hoeckele · Granby, US
• Luke T. Orsini · Marlborough, US
• Marc S. McCloud · Suffield, US
• Matthew S. Fitzpatrick · Portland, US

Key dates

• Filing date: Jan 10, 2011
• Grant date: Jan 28, 2014
• Expiry date: Feb 12, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3025
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A system comprises a package with top and bottom surfaces, a plurality of high-power transient voltage suppressors arranged within the package, and a robust lead frame. Each of the transient voltage suppressors has first and second major surfaces substantially perpendicular to the top and bottom surfaces of the package. The lead frame comprises leads connected to the major surfaces of the transient voltage suppressors. Each of the leads has a thickness greater than about 0.015 inches (or 0.381 mm) in a mounting portion, in order to dissipate heat from the transient voltage suppressors and to resist vibration-induced stress on the package.