User-serviceable liquid DIMM cooling system
US8638559B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2011 |
| Grant date | Jan 28, 2014 |
| Priority date | — |
| Expiry date | Jun 5, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling system for a memory module comprises a heat conduction assembly for conducting heat from the memory module to liquid-cooled mounting blocks. In one embodiment, each heat conduction assembly includes a frame having opposing first and second supports, first and second heat spreader plates each extending from the first support to the second support, and a pair of flattened heat pipes each extending along a respective one of the heat spreader plates from the first support to the second support. The liquid-cooled mounting blocks releasably support the heat conduction assembly over a memory module socket with the memory module between the heat spreader plates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.