Arrangement of optoelectronic components
US8638565B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | Sep 21, 2007 |
| Grant date | Jan 28, 2014 |
| Priority date | — |
| Expiry date | Sep 14, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for producing an arrangement of optoelectronic components (10) is specified, comprising the following steps: producing at least two fixing regions (2) on a first connection carrier (1); introducing solder material (3) into the fixing regions (2); applying a second connection carrier (4) to the fixing regions (2); and soldering the second connection carrier (4) onto the first connection carrier (1) with the solder material (3) in the fixing regions (2).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.