Low-profile loudspeaker driver and enclosure assembly
US8638968B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 30, 2010 |
| Grant date | Jan 28, 2014 |
| Priority date | — |
| Expiry date | Aug 24, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4957
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A high fidelity, low-profile loudspeaker assembly includes an enclosure having a rear panel which is highly thermally conductive. At least one speaker driver is mounted in the enclosure, the driver including a forwardly facing diaphragm driven by a voice coil former carrying a voice coil, and a rearwardly extending motor structure. An aperture is provided in the rear panel to receiving the driver's motor structure, and a thermally conductive gasket seals the rear panel aperture around cup to provide a thermal path from the driver motor to the rear panel for cooling the driver. On one driver embodiment, a generally dome-shaped annular spider surrounds and supports the voice coil former, the spider being connected at its inner periphery to the approximate vertical midpoint of the voice coil former.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.