Device for placing material on or beneath the soil surface
US8640636B2 · kind B2 · utility
2Cited by
43References
47Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2011 |
| Grant date | Feb 4, 2014 |
| Priority date | — |
| Expiry date | Jan 25, 2032 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA01M21/043
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A device for treating soil includes a soil contact head having at least one discharge orifice therein, a handle attached to the soil contact head, a discharge valve in fluid communication with the at least one discharge orifice, a soil contact indicator, and a source of pressurized soil treatment fluid flowably connected to the discharge valve. The discharge valve discharges the pressurized soil treatment fluid through the at least one discharge orifice when the soil contact indicator indicates contact between the soil contact head and the soil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.