Patent · US Active

Securing mechanism and method for wafer bonder

US8640755B2 · kind B2 · utility

12Cited by

0References

17Claims

0Family size

Assignee

Skyworks Solutions, Inc. · US

Inventors

Steve Canale · Simi Valley, US
David J. Zapp · Simi Valley, US

Key dates

Filing date	Oct 5, 2010
Grant date	Feb 4, 2014
Priority date	—
Expiry date	Dec 10, 2031

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T292/45
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Disclosed are various features associated with a securing mechanism for a wafer bonder. In certain situations, operation of securing mechanisms can generate undesirable particles and debris, and some them can be introduced to a wafer being bonded. In certain implementations, a securing mechanism can be configured to reduce the likelihood of such particles and debris being introduced to the wafer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.