Patent · US Active

Forming nozzles

US8641171B2 · kind B2 · utility

0Cited by
13References
4Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMay 30, 2012
Grant dateFeb 4, 2014
Priority date
Expiry dateMay 30, 2032

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB81B2201/052
  • WIPO fieldTextile and paper machines
  • WIPO sectorMechanical engineering

Abstract

Fluid ejection nozzles having a tapered section leading to a straight walled bore are described. Both the tapered section of the nozzle and the straight walled bore are formed from a single side of semiconductor layer so that the tapered section and the bore are aligned with one another, even when an array of nozzles are formed across a die and multiple dies are formed on a semiconductor substrate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.